测试技术

—— TEST TECHNOLOGY ——

Improving Wafer-Level S-parameters Measurement Accuracy and Stability with Probe-Tip Power Calibration up to 110 GHz for 5G Applications

Fig.11.S-parameter post-calibration stability performance with and without Probe-Tip power calibration,monitoring Extracted Inductance of a 1ps line over time.

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improving-wafer-level-s-param-eumc-2019-sia

An accurate and stable wafer-level 110 GHz system is needed to support measurements of devices and circuits for 5G applications.A novel method of probe-tip power calibration with S-parameter calibration has been proposed in this paper.The new instrumentation technique,named Choon’s probe-tip power calibration method is demonstrated to improve DC biasing accuracy,S-parameters measurement consistencies and accuracy as well as post-calibration stability.Using this probe-tip power calibration method,110 GHz system calibration stability is improved from 10 minutes to more than 4 hours,greatly improving the measurement throughput of such test setup,making power calibration mandatory for achieving accurate wafer-level S-parameters measurements.

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IMS2010-MicroApps-WinCalXE-TwoTierCal

Two Tier Calibration of a Vector Network Analyzer is a technique that allows two calibration error sets to be combined into one

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Optimized Impedance Standard Substrate Designs for Dual and Differential Applications

Abstract--Optimized dual signal Impedance Standard Substrate(ISS)designs are demonstrated.The optimal designs had loop-under grounds,were selected for minimum deviation from lumped element behavior and used mode dampening structures.A comparison of existing design approaches is given and the quality of the designs is illustrated to 50GHz.

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Test Setup Optimization and Automation for Accurate Silicon Photonics Wafer Acceptance Production Tests

Yurii A.Vlasov and Sharee J.McNab,“Losses in single-mode silicon-on-   insulator strip waveguides and bends”,Optical Express,Vol.12,Issue 8,pp.1622-1631,2014

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Validation of On-Wafer Vector Network Analyzers

ƒFuture work will include comparing on-wafer VNAs employing different calibration algorithms   See it.Touch it.Measure it.®

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FFI公司智能接触扎针Contact Intelligence技术以及高温射频校准方法说明V1.0

虽然Contact Intelligence™技术的应用多种多样,但它们的核心是将人们积累的工程知识嵌入到探测系统中的,因此在各种各样的情况下,它们的操作具有极高的自主性。有了Contact Intelligence™技术,测试工程师可以依靠自身的专业知识以确保准确的扎针和更快的数据处理时间,同时减少人工的干预。

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