Ultra High Temperature Probe

　　Hirofumi Nagata Alan Liao

　　•Automotive IC Market Overview

　　•Automotive IC Test Requirements and Probe Card

　　Agenda

　　Challenges

　　•FormFactor Ultra High Temperature Probe Card Solution

　　•Probe Characterization Result Under Ultra High Temperature Testing Environment

　　•Actual Probe Card Performance Result by Leading Automotive IC Customer

　　•Summary and Acknowledgement

　　Alan Liao 2

　　img2img3

　　Drive Demand of New Testing Solution

　　Automotive Semiconductor Market Overview

　　•Automotive electronics is a fast-growing market

　　–Predictions are between 3%~12%CAGR over next 5 years

　　–Average number of semiconductors in a car increases significantly in modern cars

　　–Key drivers for automotive IC growth

　　•Critical safety system

　　•Increased fuel efficiency

　　•Navigation and communication

　　•Comfort&entertainment features

　　img4

　　Alan Liao 3

　　Baseball Stadium

　　img5

　　Defect Expectation

　　Automotive Safety Consideration:Zero

　　Million(DPPM)design methodology and test to this standard

　　–Finding a golf ball in baseball field

　　•Reasons:

　　–Failure rate at the automotive level is higher

　　–massive recall and serious economic distress

　　•Probing Requirement:

　　–No Dielectric punch-through

　　Alan Liao

　　Taichung Intercontinental

　　4

　　•IC manufacturers adopt Zero Defects Parts per

　　img6

　　img7img8

　　•Support large volume demand

　　•Lower test cost

　　•Harsh outdoor environment

　　•Testing at full thermal range

　　•Minimize bond pad reliability impact

　　Automotive IC Wafer Sort Test Challenges

　　img9 Wafer sort test with multiple insertion:cold,room,hot temp

　　img10 High temp test required 125°C img11 150°C img12 175°C

　　img13 Multiple TD at same bond pad

　　img14 Large active area+high parallelism for

　　Probe card requirements:img15

　　img16SoCs img17

　　Alan Liao 5

　　img18

　　Maximize Number of DUTs to Reduce Number of TDs

　　Increase Test Efficiency=Reduce Cost of Test

　　•Require Full Wafer Touch Down Maximize Touch Down Efficiency

　　•Increase Touch Down Efficiency to Reduce Cost of Test

　　120.00%

　　100.00%

　　80.00%

　　60.00%

　　40.00%

　　20.00%

　　0.00%

　　Alan Liao

　　PH100 on small Tester PH100 NG Tester TSM NG Tester

　　35

　　30

　　25

　　20

　　15

　　10

　　5

　　0

　　30 TD 63 DUT PH100 Touch

　　img19

　　Down Pattern

　　img20

　　6 TD 234 DUT Full Wafer Contact TD Pattern

　　img21

　　6

　　Thermal Planarity Control

　　TrueScale Matrix Probe Card

　　•Thermal gradients in probe card produce differential expansion across probe card components and can produce probe card bow

　　•Design and build the probe card for better thermal planarity control

　　–Mechanical simulation to understand thermal behavior

　　–Design automation(real-time probe card deformation simulation)to optimize Mechanical Coupling Link location for planarity control

　　–Added flexible shim kit design on inner tester side stiffener

　　–Bridge beam hardware add to PC outgoing PXI metrology tool to simulate test head docking condition for planarity adjustment

　　–AOT/POT analysis on field to further understand deflection force

　　Alan Liao

　　img22

　　img23

　　7

　　img24img25TrueScale Matrix Probe Card Architecture

　　Optimize for High Parallelism and Ultra High Temperature

　　•Probe Card Design Requirements

　　–300mm probing active area

　　–Support>256 DUTs,>35000 Probe Count

　　–Smallest Pad Size and Pitch:~55um/65um

　　–Temperature Range:-40 to+165°C

　　•TSM PC Achieved Large Active Area with Highest Parallelism

　　–Full 300mm active area probing to improve touchdown efficiency

　　–FFI proprietary touchdown efficiency analysis software and service

　　–T11 UHT Probe Rated-40 to+175°C

　　–Modified TSS and Matrix architecture achieved 30um planarity

　　Alan Liao

　　img26

　　Planarity

　　img2735

　　25

　　15

　　5

　　-5

　　-15

　　-25

　　-35

　　-45

　　-55

　　-65

　　img28

　　Mean(YReference)

　　img29150000

　　100000

　　50000

　　0

　　-50000

　　-100000

　　-150000

　　-150000-50000 0 50000 100000

　　Mean(Planarity)

　　<=-10.000

　　<=-7.500

　　<=-5.000

　　<=-2.500

　　<=0.000

　　<=2.500

　　<=5.000

　　<=7.500

　　>7.500

　　Mean(X Reference)

　　8

　　9

　　DragonBlade T11.4 Ultra High Temperature Probe

　　Metric

　　T11

　　T11.4 UHT

　　Max Temperature(°C)/AOT(um)

　　<=130°C/75um

　　<=160°C/65um

　　175°C/100um

　　Min pad Pitch(um)

　　50um

　　60um

　　Scrub Ratio

　　~10%

　　Current Carrier Capacity(ISMI)

　　1.2A

　　>1A

　　Typical spring constant(gram-force/mil)

　　0.8 g/mil

　　Tip sizes at beginning of life(um)

　　6um,8.5um,or 14um±3um

　　Tip sizes at end of life(um)

　　20um

　　Alan Liao

　　img30Final Result in Production Test Environment

　　•Renesas agreed to share their collecting data.

　　–Beam creep data

　　–Contact Resistance

　　–Probe Mark Characterization Data

　　–Probe Mark Photos

　　Hirofumi Nagata 10

　　img31img32Actual Over-Travel vs.Program Over-Travel Analysis

　　•Using Pin and Sleeve to analyze probe actual over-travel

　　Install Pin&Sleeve at 5 locations on the PH.Check that the pins have shifted upwards due to the chuck loading

　　img33

　　Hirofumi Nagata

　　AOT/POT Results≈75%

　　AOT(um)

　　20

　　0

　　img34AOT/POT Results

　　120

　　100

　　80

　　60

　　40

　　20

　　img35

　　0

　　40 60 80 100

　　POT(um)

　　img36

　　160

　　120

　　140

　　11

　　Spring Creep(Beam Droop)

　　Same capability as T11 with 2x hot temp performance

　　DragonBlade T11.4 UHT Performance

　　img37

　　Hirofumi Nagata

　　T11.P spring

　　125um OT

　　img38

　　img39

　　150um OT

　　UHT Repaired

　　UHT

　　img40

　　12

　　img41Contact Resistance vs.OverDrive

　　•T11.4 UHT archived stable Cres from 30-40μm OD.

　　Hirofumi Nagata 13

　　img42

　　img43

　　14

　　img44

　　Prober Chuck

　　Temperature:

　　-40°C

　　Prober Chuck

　　Temperature:

　　160°C

　　img45

　　15

　　No Under Pad Damage at 20TD

　　img46img47

　　Hirofumi Nagata

　　Cold

　　Temperature:

　　-40°C

　　Hot

　　Temperature:

　　160°C

　　16

　　T11.4 UHT Probe Mark and Pad Reliability Analysis

　　Summary

　　•Automotive IC market continues growing with large demand and zero defects parts

　　•FormFactor Matrix platform with T11 Ultra High Temp probe provides capability of meeting zero defect testing requirement and the highest testing efficiency for automotive IC wafer sort test

　　•TrueScale Matrix with T11 UHT probe solution has been validated by key automotive customer and deployed to various tester platforms including T2000,V93K DD,J750

　　Alan Liao 17

　　img48Acknowledgement

　　Special Thanks!

　　img49

　　Tom Watson

　　Engineering Follow

　　Tetsuya Miyoshi

　　Application Engineering Manager

　　Alan Liao

　　Bunji Yasumura

　　Director of test technology

　　development dept

　　Takahiro Mizoi

　　Senior staff engineer of test

　　technology development dept